-
DigiHeat Technology
DigiHeat Technology
Raysees DigiHeat technology transforms high-power VCSEL arrays into a programmable thermal engine. With digital control over optical power, heating time, energy distribution, and processing paths, DigiHeat delivers light directly to the target area and converts it into fast, uniform, precisely controlled heat. It gives advanced manufacturing a more efficient, stable, and software-defined heat source — moving industrial heating from conventional thermal systems to intelligent, programmable energy control.
RAYSEES PROPRIETARY
TECHNOLOGY
TECHNOLOGY
Full-Stack Architecture
Optics + Control + Algorithms
Optics + Control + Algorithms
Raysees combines high-power VCSEL arrays, thermal management, and digital light-field control to turn light into precise, programmable heat — powering a faster, smarter, and more controllable future.
Core Technology Highlights
01 Precise. Uniform. Controlled.
DigiHeat digitally controls power, timing, and energy distribution to deliver targeted, uniform heating with lower thermal diffusion and reduced stress buildup.
Energy Uniformity
＞95%
02 Efficient. Instant. Energy-Saving.
Microsecond-level digital control enables instant heating with no preheating, reducing time and energy consumption in high-volume manufacturing.
Thermal Response
μs-level
03 Contact-Free. Highly Flexible.
Non-contact laser heating minimizes wear, contamination, and interference, enabling precise local heating for compact, complex, and enclosed structures.
Clean | Integrable | Minimal Damage
0 Contact
Intelligent Heat
Fully Controlled
The era of intelligent heat — digital, adaptive, and precision-controlled.
Sense
Captures temperature and timing data in real time to continuously monitor the heating process.
Control
Compares target curves with thermal models to control laser output for consistent batch heating.
Output
DigiHeat delivers millimeter-level thermal control, uniform energy coverage, and real-time process data.
Adaptive Heating
Smarter Manufacturing
Smarter Manufacturing
Adaptive Process Fit
Programmable, non-contact heating adapts across semiconductor packaging and advanced material processing.
Lower Total Cost
Efficient, selective heating and modular design reduce energy waste, simplify integration, and accelerate production.
Ready for Scale
Full-stack technology and in-house manufacturing support a smooth path from R&D validation to mass production.
Contact us for more information
Contact us